- Device
- Technical University Darmstadt
MOT semicon
- Materials Science
- Structuring and Processing of Materials
- Device Type
- Electroplating System
- Device Name
- MOT semicon
- Device Variants
- Electroplating System for Wafers
Device Description
Nickel and copper electroplating for 4‑inch wafers; nickel sulfamate and acidic copper baths; deposition rate 1 µm/min at 5 A/dm²; current up to 10 A; pulse plating.
Device Application
MEMS fabrication.
